Co-occurring keywords · papers mentioning both
Papers
Point Cloud Segmentation of Integrated Circuits Package Substrates Surface Defects Using Causal Inference: Dataset Construction and Methodology
AAAI 2026
Anomaly Detection of Integrated Circuits Package Substrates Using the Large Vision Model SAIC: Dataset Construction, Methodology, and Application
ICCV 2025
FlexPlanner: Flexible 3D Floorplanning via Deep Reinforcement Learning in Hybrid Action Space with Multi-Modality Representation
NeurIPS 2024
SyncTREE: Fast Timing Analysis for Integrated Circuit Design through a Physics-informed Tree-based Graph Neural Network
NeurIPS 2023
Automated Defect Inspection in Reverse Engineering of Integrated Circuits
WACV 2022
REFICS: A Step Towards Linking Vision With Hardware Assurance
WACV 2022